Ultrasonic Plastic Welding machine is mechanical vibration energy that operates at frequencies above sound waves (normal human hearing has an upper frequency limit of 18 kHz). The frequency of ultrasonic bonding used in semiconductor packaging is generally 40 kHz to 120 kHz. Ultrasonic pressure welding is a solid-phase welding method. This special solid-phase welding method can be simply described as: at the beginning of welding, the metal material undergoes strong plastic flow under the action of friction, forming a bond between pure metal surfaces. Contact creates the conditions. The temperature rise and high-frequency vibration of the junction area further cause the atoms on the metal lattice to be activated. Therefore, when metal atoms with covalent bonding properties are close to each other to a distance measured in nanometers. It is possible to form an electronic bridge between atoms through public electrons, which realizes the so-called metal "bonding" process
The research on the welding process shows that friction, plastic flow and temperature are the three main interdependent factors to achieve ultrasonic welding, among which friction plays a leading role, which is not only the main heat source in welding, but also by eliminating the oxide film for pure Contact between metal surfaces creates conditions
Body material:Precision steel frame
Electric box"Aluminum alloy shell touch screen
Quality management:Export Welding Data to U Disk
Frequency:15-20KHZ